At SEMICON Europe 2026, we will be presenting a new generation of load ports that opens up new possibilities for automated wafer handling.
The standout feature: mapping for wafers as thin as 100 µm—currently unique on the market.
The LP200-SMIF W GEN2 combines this technology with high process reliability, precise sensor technology, and comprehensive automation compatibility—developed to meet the demanding requirements of modern semiconductor manufacturing.
Precise. Reliable. Automated. Made by LIEB.
📍 Munich Exhibition | November 10–13, 2026
📌 Hall B1 | Booth 279
Three technological highlights in one generation of load ports
The LP200-SMIF W GEN2 was developed to meet the growing demands of modern semiconductor manufacturing, with a particular focus on three areas.
As a result, the LP200-SMIF W GEN2 combines precise wafer mapping, future-oriented machine safety, and comprehensive safety sensor technology in a single generation of load ports.
Discover our new LP200-SMIF W GEN2 live at our booth at SEMICON Europe 2026.

We have been developing and manufacturing automation solutions for demanding applications for many years.
Our strength lies in the combination of:
Custom technical solutions for demanding applications.
Expertise in precise and reliable automated processes.
Technologies tailored to the specific requirements of the semiconductor industry.
Development and manufacturing with high level of expertise and vertical integration in Germany.
We don’t just develop products. We develop solutions for the demands of tomorrow.
From November 10 to 13, 2026, meet LIEB at SEMICON Europe in Munich.
📍 Munich Exhibition
📌 Hall B1 | Booth 279
Experience our LP200-SMIF W GEN2 live, see the technology in action, and talk directly with our experts about your application.
Schedule an appointment with our team before the exhibition.